Schloss Dagstuhl - Leibniz-Zentrum fuer Informatik GmbH Schloss Dagstuhl - Leibniz-Zentrum fuer Informatik GmbH scholarly article en Castrillón-Mazo, Jerónimo; Kuo, Tei-Wei; Riel, Heike E.; Lieber, Matthias http://www.dagstuhl.de/dagrep License
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URN: urn:nbn:de:0030-drops-73499
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Weitere Beteiligte (Hrsg. etc.): Jerónimo Castrillón-Mazo and Tei-Wei Kuo and Heike E. Riel and Matthias Lieber

Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061)

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Abstract

The end of exponential scaling in conventional CMOS technologies has been forecasted for many years by now. While advances in fabrication made it possible to reach limits beyond those predicted, the so anticipated end seems to be imminent today. The main goal of the seminar 17061 "Wildly Heterogeneous Post-CMOS Technologies Meet Software" was to discuss bridges between material research, hardware components and, ultimately, software for information processing systems. By bringing together experts from the individual fields and also researchers working interdisciplinarily across fields, the seminar helped to foster a mutual understanding about the challenges of advancing computing beyond current CMOS technology and to create long-term visions about a future hardware/software stack.

BibTeX - Entry

@Article{castrillnmazo_et_al:DR:2017:7349,
  author =	{Jer{\'o}nimo Castrill{\'o}n-Mazo and Tei-Wei Kuo and Heike E. Riel and Matthias Lieber},
  title =	{{Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061)}},
  pages =	{1--22},
  journal =	{Dagstuhl Reports},
  ISSN =	{2192-5283},
  year =	{2017},
  volume =	{7},
  number =	{2},
  editor =	{Jer{\'o}nimo Castrill{\'o}n-Mazo and Tei-Wei Kuo and Heike E. Riel and Matthias Lieber},
  publisher =	{Schloss Dagstuhl--Leibniz-Zentrum fuer Informatik},
  address =	{Dagstuhl, Germany},
  URL =		{http://drops.dagstuhl.de/opus/volltexte/2017/7349},
  URN =		{urn:nbn:de:0030-drops-73499},
  doi =		{10.4230/DagRep.7.2.1},
  annote =	{Keywords: 3D integration, compilers, emerging post-CMOS circuit materials and technologies, hardware/software co-design, heterogeneous hardware, nanoelectronics}
}

Keywords: 3D integration, compilers, emerging post-CMOS circuit materials and technologies, hardware/software co-design, heterogeneous hardware, nanoelectronics
Seminar: Dagstuhl Reports, Volume 7, Issue 2
Issue date: 2017
Date of publication: 2017


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