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@Article{castrillnmazo_et_al:DR:2017:7349, author = {Jer{\'o}nimo Castrill{\'o}n-Mazo and Tei-Wei Kuo and Heike E. Riel and Matthias Lieber}, title = {{Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061)}}, pages = {1--22}, journal = {Dagstuhl Reports}, ISSN = {2192-5283}, year = {2017}, volume = {7}, number = {2}, editor = {Jer{\'o}nimo Castrill{\'o}n-Mazo and Tei-Wei Kuo and Heike E. Riel and Matthias Lieber}, publisher = {Schloss Dagstuhl--Leibniz-Zentrum fuer Informatik}, address = {Dagstuhl, Germany}, URL = {http://drops.dagstuhl.de/opus/volltexte/2017/7349}, URN = {urn:nbn:de:0030-drops-73499}, doi = {10.4230/DagRep.7.2.1}, annote = {Keywords: 3D integration, compilers, emerging post-CMOS circuit materials and technologies, hardware/software co-design, heterogeneous hardware, nanoelectronics} }
Keywords: | 3D integration, compilers, emerging post-CMOS circuit materials and technologies, hardware/software co-design, heterogeneous hardware, nanoelectronics | |
Seminar: | Dagstuhl Reports, Volume 7, Issue 2 | |
Issue date: | 2017 | |
Date of publication: | 15.08.2017 |