BibTeX Export for Engineering On-Chip Thermal Effects

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@InProceedings{schaumont:DagSemProc.09282.5,
  author =	{Schaumont, Patrick},
  title =	{{Engineering On-Chip Thermal Effects}},
  booktitle =	{Foundations for Forgery-Resilient Cryptographic Hardware},
  pages =	{1--2},
  series =	{Dagstuhl Seminar Proceedings (DagSemProc)},
  ISSN =	{1862-4405},
  year =	{2010},
  volume =	{9282},
  editor =	{Jorge Guajardo and Bart Preneel and Ahmad-Reza Sadeghi and Pim Tuyls},
  publisher =	{Schloss Dagstuhl -- Leibniz-Zentrum f{\"u}r Informatik},
  address =	{Dagstuhl, Germany},
  URL =		{https://drops-dev.dagstuhl.de/entities/document/10.4230/DagSemProc.09282.5},
  URN =		{urn:nbn:de:0030-drops-24032},
  doi =		{10.4230/DagSemProc.09282.5},
  annote =	{Keywords: PUFs, temperature effects, covert temperature channel, ring oscillator PUF, FPGAs}
}

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