DagSemProc.09282.5.pdf
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Engineering On-Chip Thermal Effects
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Dagstuhl Seminar Proceedings, Volume 9282
Series: Dagstuhl Seminar Proceedings (DagSemProc) - License:
Creative Commons Attribution 4.0 International license
- Publication Date: 2010-01-13
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Patrick Schaumont. Engineering On-Chip Thermal Effects. In Foundations for Forgery-Resilient Cryptographic Hardware. Dagstuhl Seminar Proceedings, Volume 9282, pp. 1-2, Schloss Dagstuhl – Leibniz-Zentrum für Informatik (2010)
https://doi.org/10.4230/DagSemProc.09282.5
https://doi.org/10.4230/DagSemProc.09282.5
Abstract
Temperature effects can be used to maliciously affect the behavior of
digital crypto-circuits. For example, temperature effects can create
covert communication channels, and they can affect the stability of
physical unclonable functions (PUFs). This talk observes that these
thermal effects can be engineered, and we describe two techniques. The
first technique shows how to filter the information through a covert
temperature channel. This leads to detectors for very specific events,
for example, someone touching the chip package. The second technique
shows how to mitigate the impact of temperature on a PUF design while
avoiding costly post-processing. We discuss the design of a compact
ring-oscillator PUF for FPGA which is tolerant to temperature
variations.
Keywords
- PUFs
- temperature effects
- covert temperature channel
- ring oscillator PUF
- FPGAs
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