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Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061)

Authors: Jerónimo Castrillón-Mazo, Tei-Wei Kuo, Heike E. Riel, and Matthias Lieber

Published in: Dagstuhl Reports, Volume 7, Issue 2 (2017)


Abstract
The end of exponential scaling in conventional CMOS technologies has been forecasted for many years by now. While advances in fabrication made it possible to reach limits beyond those predicted, the so anticipated end seems to be imminent today. The main goal of the seminar 17061 "Wildly Heterogeneous Post-CMOS Technologies Meet Software" was to discuss bridges between material research, hardware components and, ultimately, software for information processing systems. By bringing together experts from the individual fields and also researchers working interdisciplinarily across fields, the seminar helped to foster a mutual understanding about the challenges of advancing computing beyond current CMOS technology and to create long-term visions about a future hardware/software stack.

Cite as

Jerónimo Castrillón-Mazo, Tei-Wei Kuo, Heike E. Riel, and Matthias Lieber. Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061). In Dagstuhl Reports, Volume 7, Issue 2, pp. 1-22, Schloss Dagstuhl – Leibniz-Zentrum für Informatik (2017)


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@Article{castrillonmazo_et_al:DagRep.7.2.1,
  author =	{Castrill\'{o}n-Mazo, Jer\'{o}nimo and Kuo, Tei-Wei and Riel, Heike E. and Lieber, Matthias},
  title =	{{Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061)}},
  pages =	{1--22},
  journal =	{Dagstuhl Reports},
  ISSN =	{2192-5283},
  year =	{2017},
  volume =	{7},
  number =	{2},
  editor =	{Castrill\'{o}n-Mazo, Jer\'{o}nimo and Kuo, Tei-Wei and Riel, Heike E. and Lieber, Matthias},
  publisher =	{Schloss Dagstuhl -- Leibniz-Zentrum f{\"u}r Informatik},
  address =	{Dagstuhl, Germany},
  URL =		{https://drops.dagstuhl.de/entities/document/10.4230/DagRep.7.2.1},
  URN =		{urn:nbn:de:0030-drops-73499},
  doi =		{10.4230/DagRep.7.2.1},
  annote =	{Keywords: 3D integration, compilers, emerging post-CMOS circuit materials and technologies, hardware/software co-design, heterogeneous hardware, nanoelectronics}
}
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